R&D Partner

The hardware work package for your R&D project, from feasibility to TRL 7–8

We design the electronics and embedded firmware that turn a funded idea into hardware that passes milestone reviews: architecture, components, schematics and PCB, firmware, test plan, commissioning and documentation. We work as a subcontractor or a consortium member in FENG, NCBR and regional programmes.

What we deliver

One partner for the hardware, from the application to production.

1. Before the application

2-week feasibility sprint

Architecture and block diagram, key-part selection, power budget, risk register, rough BOM and prototype cost, milestone plan. This is the technical annex of the application.

2. During the project

Design and prototypes

Spec → schematic → layout → 2–3 prototype iterations. Firmware and services, CI-checked design files with visual diffs per revision, a test plan per milestone, a commissioning record per sample.

3. At handover

Ready for production

EMC pre-scan, climate tests, a DFM pack for your EMS, a production test jig and documentation reviewers accept. No "lab-only" prototypes.

How we work

Three stages, each with a clear deliverable and a known price.

Feasibility sprint

2 weeks

Architecture, key parts, power budget, risk register, rough BOM, prototype cost, milestones: the technical annex for the application.

9,000 PLN fixed

Before the application (applicant's or consultant's budget)

Work package

18–24 months

Spec → schematic → layout → 2–3 prototype iterations → firmware → test plan → commissioning → documentation per milestone.

300–600k PLN

Monthly or per milestone

Pre-compliance & handover

At TRL 7–8

EMC pre-scan, climate tests, DFM pack for the EMS, production test jig.

25–60k PLN, or inside the work package

At TRL 7–8

Role: subcontractor (simplest; subject to the call's subcontracting limits) or consortium member (bigger share, must be agreed before submission). We check the rules of each call with you and your grant consultant.

Documents reviewers can check

Every work package follows the same chapters, from the specification to commissioning.

01

Requirements analysis

The specification mapped block by block to design decisions.

02

Block diagram and power budget

A power tree with named rails and a typical/peak budget per consumer.

03

Component selection

A shortlist per block with EU-origin preference and cost per part.

04

Interface contract

Pinouts, polarities, timings and the hardware ↔ firmware protocol.

05

Risk register

Every risk rated, with a mitigation and an owner.

06

Test plan

Power, watchdog, interfaces, RF/EMC, environment and mechanics.

07

Commissioning procedure

A step-by-step bring-up with a record per serial number.

08

Open-items log

Decisions tracked with owner (client, design, sample) and date.

Technical capabilities

Best fit: GNSS and positioning, environmental and structural sensing, power electronics and energy, industrial I/O and IoT gateways.

Electronics

  • •SoM carrier boards (Raspberry Pi CM4/CM5 class), high-speed routing: PCIe/NVMe, USB 3, GbE
  • •GNSS (multi-band RTK), LTE/cellular, Wi-Fi; antenna feeds and RF layout practice
  • •Power paths: USB-C sink, redundant inputs, eFuses, buck converters, power budgets
  • •Supervisors and watchdogs, level shifting across power domains, back-power rules
  • •Sensors: MEMS IMU/accelerometers, RTCs, RS232/RS485 industrial I/O

Firmware, software and process

  • •Bare-metal MCU firmware with host-testable state machines; Linux services (systemd, Python)
  • •KiCad with CI: ERC/DRC on every commit, reproducible outputs, visual diffs per revision
  • •A shared, reviewed component library; datasheet-verified part selection
  • •Documentation built for the milestone review: spec traceability, risk register, test reports

Programmes we work in

FENG (for example Ścieżka SMART and B+R projects), NCBR calls, regional programmes (for example FE SL and FEDS) and selected Horizon Europe / EIC calls as a technical partner.

For grant consultants

We give you a credible technical partner for hardware-heavy applications. The feasibility sprint can be delivered white-label as the technical annex of your application. We don't write applications; we make the technical part hold up in review and in delivery.

Questions

Do you write the grant application?+

No. We make the technical part hold up in review and in delivery. The application is written by you or your grant consultant; the feasibility sprint gives them the technical annex.

Subcontractor or consortium member?+

Both are possible. Subcontracting is the simplest, within the call's subcontracting limits. A consortium role gives a bigger share and must be agreed before submission. We check the rules of each call with you and your grant consultant.

Which programmes do you work in?+

FENG (for example Ścieżka SMART and B+R projects), NCBR calls, regional programmes such as FE SL and FEDS, and selected Horizon Europe / EIC calls as a technical partner.

Can we see a reference project?+

Yes, on a call. Our current reference is a work package in a nationally funded, EU co-financed R&D project with a university partner; details are shared under NDA until the partner agrees to publish them.

Is the hardware part realistic?

A 30-minute feasibility call: you describe the idea and the call, we tell you if the hardware part is realistic in budget and time.

Book the call